Showing 1 - 20 results of 90 for search '"Mechanical Engineering"' Refine Results
  1. 1
    Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects
    by Deepa Bhatt, David Hutt, Paul Conway
    Published 2012
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  2. 2
    Packaging of microfluidic devices for fluid interconnection using thermoplastics
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  3. 3
    Protrusion of Cu-TSV under different strain states
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  4. 4
    Mechanisms of copper protrusion in through-silicon-via structures at the nanoscale
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  5. 5
    A case-based reasoning approach for low volume, high added value electronics
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  6. 6
    Transition zone: a training ethos designed to scaffold a PhD degree
    by Carmen Torres, Paul Conway
    Published 2019
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  7. 7
    Process variables in the reflow soldering of surface mount
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  8. 8
    Under bump metallisation of fine pitch flip-chip using electroless nickel deposition
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  9. 9
    Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufacture
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  10. 10
    Materials and processes issues in fine pitch eutectic solder flip chip interconnection
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  11. 11
    Solder paste reflow modeling for flip chip assembly
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  12. 12
    Scanning acoustic microscopy investigation of engineered flip-chip delamination
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  13. 13
    Observations of solder paste reflow by means of electrical measurements
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  14. 14
    Productionisation issues for commercialisation of microfluidic based devices
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  15. 15
    Polymer optical waveguide fabrication using laser ablation
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  16. 16
    3D printing of high performance low temperature sintered ceramic substrates for microwave applications
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  17. 17
    Additive manufacturing of metal-ceramic metamaterials for RF communications
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  18. 18
    Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integration
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  19. 19
    An atomistic study of copper extrusion in through-silicon-via using phase field crystal models
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  20. 20
    A wavelet analysis on digital microstructure in microbumps
    by Zhiheng Huang, Hao Lv, Paul Conway
    Published 2015
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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