A wavelet analysis on digital microstructure in microbumps
© 2015 IEEE. Heterogeneous three-dimensional system integration is the ultimate goal for packaging and integration, where materials are pushed to their physical limits. In this context, the microstructure of packaging materials, which exhibits a multi-scale nature, will be carefully designed and tig...
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Main Authors: | , , |
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Format: | Default Conference proceeding |
Published: |
2015
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Subjects: | |
Online Access: | https://hdl.handle.net/2134/20645 |
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