Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects
Machining of microvias in 100-50 μm thick CMZ glass using an excimer laser (248 nm) was investigated. The effect of various laser process parameters: pulse energy, repetition rate, irradiation time were studied to optimise the microvia drilling process and a process window was identified. Through-ho...
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| Main Authors: | , , |
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| Format: | Default Article |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/13359 |
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