Packaging of microfluidic devices for fluid interconnection using thermoplastics
A new packaging method for microfluidic devices is proposed of polymer over-molding to form a fluidic manifold integrated with the device in a single step. The anticipated advantages of the proposed method of packaging are ease of assembly and low part count, making it suitable for low cost and high...
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| Main Authors: | , , , , |
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| Format: | Default Article |
| Published: |
2009
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4620 |
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