Process variables in the reflow soldering of surface mount
The variety of surface mount device (SMD) terminations, solder pad shape and surface properties, soldering processes, and properties of solder pastes currently leads to ill-understood and ad hoc methods of specifying component terminations, joint geometry, and soldering parameters and to the consequ...
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| Main Authors: | , , , , |
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| Format: | Default Text |
| Published: |
1990
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3873 |
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