Solder paste reflow modeling for flip chip assembly
Solder paste printing and reflow can provide low cost techniques producing the solder bumps on flip chips. Solder paste consists of a dense suspension of solder particles in a fluid medium (vehicle) that acts as an oxide reducing agent (flux) during reflow, cleaning the metal surfaces of oxides. Thi...
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| Main Authors: | , , , , , |
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| Format: | Default Text |
| Published: |
2000
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3926 |
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