Materials and processes issues in fine pitch eutectic solder flip chip interconnection
New product designs within the electronics packaging industry continue to demand interconnects at microscopic geometry, both at the Integrated Circuit (IC) and supporting board level, thereby creating numerous manufacturing challenges. Flip Chip On Board (FCOB) applications are currently being drive...
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| Main Authors: | , , , , |
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| Format: | Default Conference proceeding |
| Published: |
2004
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4210 |
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