Showing 1 - 20 results of 90 for search '"Mechanics."' Refine Results
  1. 1
    Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  2. 2
    Inelastic behaviour of bacterial cellulose hydrogel: in aqua cyclic tests
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  3. 3
    Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  4. 4
    Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  5. 5
    Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  6. 6
    Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  7. 7
    Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-W-P metallization in high temperature electronics interconnects
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  8. 8
    Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  9. 9
    Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  10. 10
    Fine pitch printing on a non-woven fabric for high frequency applications
    by Ying Ying Lim, Yee Goh, Changqing Liu
    Published 2013
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  11. 11
    Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  12. 12
    Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  13. 13
    Process and performance modelling for individual ACA conductor particles
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  14. 14
    Electrically conductive adhesive enable to manufacture high performance patch probe for non-invasive physiological assessment
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  15. 15
    Adhesion of aerosol deposition traces targeted for flexible electronics applications
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  16. 16
    Silver screen printed transmission lines- influence of substrate porosity on the RF performance and modelling up to 30GHz
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  17. 17
    Under bump metallisation of fine pitch flip-chip using electroless nickel deposition
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  18. 18
    Materials and processes issues in fine pitch eutectic solder flip chip interconnection
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  19. 19
    Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  20. 20
    TEM microstructural analysis of as-bonded copper ball bonds on aluminum metallization
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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