Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test
This study focuses on the microstructural evolution process of Cu–Sn–Ni intermetallic compounds (IMCs) interlayer in the micro-joints, formed from the initial Ni/Sn (1.5 µm)/Cu structure through transient liquid phase (TLP) soldering. Under the bonding temperature of 240 °C, the micro-joints evolve...
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| Main Authors: | , , , , |
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| Format: | Default Article |
| Published: |
2018
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/36624 |
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