TEM microstructural analysis of as-bonded copper ball bonds on aluminum metallization
In this study, the nano-scale interfacial details of ultrasonic copper ball bonding to an aluminum metallization in the as-bonded states were investigated using high resolution scanning/transmission electron microscopy with energy dispersive spectroscopy. Our results showed that ultrasonic vibration...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Default Conference proceeding |
| Published: |
2008
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/5333 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|