Showing 1 - 20 results of 73 for search '"Mechanics."' Refine Results
  1. 1
    Non-destructive defect detection for MEMS devices using transient thermography
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  2. 2
    Laser processing of printed copper interconnects on polymer substrates
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  3. 3
    Comparison of heatsinks used for the thermal management of LEDs
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  4. 4
    Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  5. 5
    Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  6. 6
    Process and performance modelling for individual ACA conductor particles
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  7. 7
    A review of LED technology trends and relevant thermal management strategies
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  8. 8
    Temperature cycling of surface mounted thick film 'zero-ohm' jumpers
    by David Whalley, D.S. Campbell
    Published 1987
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  9. 9
    A case-based reasoning approach for low volume, high added value electronics
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  10. 10
    The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  11. 11
    Process variables in the reflow soldering of surface mount
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  12. 12
    Under bump metallisation of fine pitch flip-chip using electroless nickel deposition
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  13. 13
    Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufacture
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  14. 14
    Materials and processes issues in fine pitch eutectic solder flip chip interconnection
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  15. 15
    Solder paste reflow modeling for flip chip assembly
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  16. 16
    Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  17. 17
    A comparison of modelling methods for electronic interconnect structures
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  18. 18
    Scanning acoustic microscopy investigation of engineered flip-chip delamination
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  19. 19
    Novel rework techniques for electronic assemblies
    by A.D. Stennett, David Whalley
    Published 1998
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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  20. 20
    Thermal interface materials - a review of the state of the art
    Subjects: '; “...Mechanical engineering not elsewhere classified...”
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