Showing 1 - 12 results of 12 for search '"Electronics"' Refine Results
  1. 1
    Further enhancement of thermal conductivity through optimal uses of h-BN fillers in polymer-based thermal interface material for power electronics
    Subjects: '; “...Power electronics...”
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  2. 2
    Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging
    Subjects: '; “...Electrical and Electronic Engineering...”
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  3. 3
    Transient liquid phase bonding with Ga-based alloys for electronics interconnections
    Subjects: '; “...Electronics packaging...”
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  4. 4
    The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films
    by Yan Zhang, Changqing Liu, David Whalley
    Published 2012
    Subjects: '; “...Printed electronics...”
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  5. 5
    The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing
    by Yan Zhang, Changqing Liu, David Whalley
    Published 2012
    Subjects: '; “...Printed electronics...”
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  6. 6
    The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers
    by Yan Zhang, Changqing Liu, David Whalley
    Published 2013
    Subjects: '; “...Printed electronics...”
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  7. 7
    Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects
    Subjects: '; “...Hightemperature electronics packaging...”
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  8. 8
    Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics
    Subjects: '; “...Power electronics...”
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  9. 9
    Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging
    Subjects: '; “...Power electronic systems packaging...”
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  10. 10
    Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition
    Subjects: '; “...Electron backscatter diffraction...”
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  11. 11
    A novel yet effective motion artefact reduction method for continuous physiological monitoring
    Subjects: '; “...Opto-electronic sensor...”
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  12. 12
    Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy
    by Zhaoxia Zhou, Li Liu, Changqing Liu
    Published 2018
    Subjects: '; “...In-situ electron microscopy...”
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