Transient liquid phase bonding with Ga-based alloys for electronics interconnections
Significant demands on electronics packaging are driven by miniaturization, energy efficiency, high performance, and minimal carbon footprint. Liquid Ga and Ga-based alloys as interconnect materials exhibit a great potential in these applications due to the benefits including low melting points, non...
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| Main Authors: | , , , |
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| Format: | Default Article |
| Published: |
2022
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/22183039.v1 |
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