Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging
Sintering of nano Ag paste on bare Cu has attracted more interests recently for high-temperature electronics packaging, which offers the advantages of high reliability, cost-effective and direct bonding process. However, the current bonding methods normally need a protective atmosphere or metallizat...
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| Main Authors: | , , , , |
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| Format: | Default Article |
| Published: |
2021
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/17105465.v1 |
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