Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending

by Li Liu, Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An
Published 2016

Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging

by Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An, Longzao Zhou
Published 2015

Process and performance modelling for individual ACA conductor particles

by Junlei Tao, David Whalley, Changqing Liu, J.Y. He
Published 2014

Low frequency induction heating for the sealing of plastic microfluidic systems

by Benedikt J. Knauf, Patrick Webb, Changqing Liu, Paul Conway
Published 2010

Preferential growth of intermetallics under temperature gradient at Cu-Sn interface during transient liquid phase bonding: insights from phase field simulation

by Shuibao Liang, Anil Kunwar, Changqing Liu, Han Jiang, Zhaoxia Zhou
Published 2022

Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging

by Canyu Liu, Allan Liu, Yutai Su, Zhaoxia Zhou, Changqing Liu
Published 2021

Integration of a microfluidic chip with multiplexed optical fluorescence detector through anisotropic etching of Si using Tetramethylammonium hydroxide (TMAH)

by Hannah Robbins, Changqing Liu, Sijung Hu, Tung T. Bui, Masahiro Aoyagi
Published 2016

Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test

by Liping Mo, Chaowei Guo, Zheng Zhou, Fengshun Wu, Changqing Liu
Published 2018

Fracture behaviour of bacterial cellulose hydrogel: Microstructural effect

by Xing Gao, Zhijun Shi, Changqing Liu, Guang Yang, Vadim Silberschmidt
Published 2016

Formation and homogenisation of Sn-Cu interconnects by self-propagated exothermic reactive bonding

by Wenbo Zhu, Xiaoting Wang, Changqing Liu, Zhaoxia Zhou, Fengshun Wu
Published 2019

Conductive microfluidic interconnects to enable scalable 3D manufacturing of wearable electronics

by Jonny Flowers, Changqing Liu, Sean Mitchell, Andy Harland, Dale Esliger
Published 2016

An investigation into zinc diffusion and tin whisker growth for electroplated tin deposits on brass

by Mark Ashworth, Geoffrey Wilcox, Rebecca Higginson, Richard Heath, Changqing Liu
Published 2014

Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder

by Guang Chen, Fengshun Wu, Changqing Liu, Weisheng Xia, Hui Liu
Published 2015

Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections

by Junlei Tao, David Whalley, Changqing Liu, Fengshun Wu, H. Kristiansen
Published 2015

Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates

by Mark Ashworth, Geoffrey Wilcox, Rebecca Higginson, Richard Heath, Changqing Liu
Published 2013

Adhesion of precision welded lead-free electrical interconnects formed by molten droplet deposition

by Patrick Webb, Changqing Liu, Farhad Sarvar, Paul Conway, K. Williams
Published 2007

Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging

by Jacob Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth
Published 2014

Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

by Guang Chen, Fengshun Wu, Changqing Liu, Vadim Silberschmidt, Y.C. Chan
Published 2016

Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnects

by Jing Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth
Published 2015

Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packaging

by Jing Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth
Published 2014