Showing 1 - 3 results of 3 for search '"Electronic packaging"' Refine Results
  1. 1
    Transient liquid phase bonding with Ga-based alloys for electronics interconnections
    Subjects: '; “...Electronics packaging...”
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  2. 2
    Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects
    Subjects: '; “...Hightemperature electronics packaging...”
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  3. 3
    Gallium-based transient liquid phase bonding for Cu-Cu electronic interconnections
    by Yi Chen
    Published 2023
    Subjects: '; “...Electronics packaging...”
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