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Showing 1 - 20 results of 88 for search '"Electronic packaging"' Refine Results
  1. 1
    Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.].
    Published 1998
    Subjects: '; “...Electronic packaging...”
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  2. 2
    Chip scale package (CSP) : design, materials, processes, reliability, and applications / John Lau, Shi-Wei Ricky Lee.
    by Lau, John H.
    Published 1999
    Subjects: '; “...Electronic packaging...”
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  3. 3
    Practical guide to the packaging of electronics : thermal and mechanical design and analysis / Ali Jamnia.
    by Jamnia, Ali, 1961-
    Published 2002
    Subjects: '; “...Electronic packaging...”
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  4. 4
    Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... (et al.)..
    Published 1994
    Subjects: '; “...Electronic packaging Defects...”
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  5. 5
    Electronic packaging : materials and their properties / Michael G. Pecht ... [et al.].
    Published 1999
    Subjects: '; “...Electronic packaging Materials...”
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  6. 6
    Materials for electronic packaging / edited by Deborah D. L. Chung.
    Published 1995
    Subjects: '; “...Electronics Electronic packaging...”
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  7. 7
    Electronic Packaging Technology, 2007, ICEPT 2007, 8th International Conference on date, 14-17 Aug., 2007.
    Published 2007
    Subjects: '; “...Electronic packaging Congresses....”
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  8. 8
    ICEPT 2006 proceedings : 7th International Conference on Electronics Packaging Technology chairman, Keyun, Bi.
    Published 2006
    Subjects: '; “...Electronic packaging Congresses....”
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  9. 9
    Proceedings, 2008 International Conference on Electronic Packaging Technology & High Density Packaging ICEPT-HDP 2008 : location, Riverfront Business Hotel, Pudong, Shanghai, China : dates, Monday, July 28 to Thursday, July 31, 2008 / directed by China Institute of Electronics ... [et al.] ; sponsored by China Electronics Packaging Society, of China Institute of Electronics, China (CEPS) ... [et al.] ; organized by China Electronics Packaging Society of China Institute of Electronics (CEPS) ... [et al.] ; co-organized by Hong Kong Applied Science & Technology Research Institute (ASTRI) ... [et al.] ; editors, Keyun Bi, Fei Xiao.
    Published 2008
    Subjects: '; “...Electronic packaging Congresses....”
    IEEE Xplore
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  10. 10
    6th International Conference on Electronic Packaging Technology La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 / sponsored by Chinese Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with, IEEE-CPMT (USA) ... [et al.].
    Published 2006
    Subjects: '; “...Electronic packaging Congresses....”
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  11. 11
    Materials for high-density electronic packaging and interconnection : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
    Published 1990
    Subjects: '; “...Electronic packaging Materials...”
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  12. 12
    Journal of electronic packaging : transactions of the ASME.
    Subjects: '; “...Electronic packaging Periodicals....”
    Serial
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  13. 13
    Journal of electronic packaging transactions of the ASME.
    Subjects: '; “...Electronic packaging Periodicals....”
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  14. 14
    Advanced wirebond interconnection technology / by Shankara K. Prasad.
    by Prasad, Shankara K.
    Published 2004
    Subjects: '; “...Wire bonding (Electronic packaging) Production control....”
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  15. 15
    Reliability of electronic packages and semiconductor devices.
    by Di Giacomo, Giulio
    Published 1997
    Subjects: '; “...Electronic packaging...”
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  16. 16
    Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harman.
    by Harman, George G.
    Published 1997
    Edition: 2nd ed..
    Subjects: '; “...Wire bonding (Electronic packaging) Production control...”
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  17. 17
    Handbook of polymer coatings for electronics : chemistry, technology, and applications / by James J. Licari, Laura A. Hughes..
    by Licari, James J., 1930-
    Published 1990
    Edition: 2nd ed.
    Subjects: '; “...Electronic packaging Materials...”
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  18. 18
    2007 9th Electronics Packaging Technology Conference 10-12 December 2007, Singapore.
    Published 2007
    Subjects: '; “...Electronic packaging Congresses....”
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  19. 19
    EPTC 2008 10th anniversary Electronics Packaging Technology Conference 9-12 December 2008, Singapore / organizer, IEEE ReIiability/CPMT/ED Singapore Chapter ; sponsors, IEEE Components, Packaging and Manufacturing Technology Society ... [et al.].
    Published 2008
    Subjects: '; “...Electronic packaging Congresses....”
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  20. 20
    2006 8th Electronics Packaging Technology Conference (EPTC 2006) 6-8 December 2006, Singapore / edited by John H.L. Pang ... [et al.] ; organized by IEEE Reliability/CPMT/ED Singapore Chapter ; sponsored by IEEE CPMT Society ; technically sponsored by IMAPS.
    Published 2006
    Subjects: '; “...Electronic packaging Congresses....”
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