6th International Conference on Electronic Packaging Technology La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 / sponsored by Chinese Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with, IEEE-CPMT (USA) ... [et al.].

6th International Conference on Electronic Packaging Technology La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 / sponsored by Chinese Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with, IEEE-CPMT (USA) ... [et al.]. La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 /

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Bibliographic Details
Corporate Authors: International Conference on Electronic Packaging Technology Shenzhen, China, Zhongguo dian zi xue hui, Components, Packaging & Manufacturing Technology Society
Format: eBook
Language:English
Published: [Piscataway, N.J.] : IEEE, c2006.
Subjects:
Electronic packaging > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=10464
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