Atomic layer deposition (ALD) to mitigate tin whisker growth and corrosion issues on printed circuit board assemblies

Atomic layer deposition (ALD) to mitigate tin whisker growth and corrosion issues on printed circuit board assemblies

This paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process variables on the ability of the coating to mitigate...

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Bibliographic Details
Main Authors: Terho Kutilainen, Marko Pudas, Mark Ashworth, Tero Lehto, Liang Wu, Geoffrey Wilcox, Jing Wang, Paul Collander, Jussi Hokka
Format: Default Article
Published: 2019
Subjects:
Tin whiskers
Corrosion
Atomic layer deposition
ALD
Online Access:https://hdl.handle.net/2134/9751922.v1
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https://hdl.handle.net/2134/9751922.v1

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