Embedding electronic circuitry into a metal matrix via ultrasonic additive manufacturing: material considerations and process development
Ultrasonic Additive Manufacturing (UAM) is a hybrid metal additive manufacturing process, based on the layer-by-layer ultrasonic welding of thin metal foils and the periodic CNC machining of the bonded layers to achieve the desired three-dimensional geometry. Bonding in UAM occurs in the solid state...
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Format: | Default Thesis |
Published: |
2018
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Online Access: | https://hdl.handle.net/2134/36056 |
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