Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions
This paper concerns the reliability of thermosonically bonded 25μm Au wires in the combined high temperature with vibration conditions, under which the tests have been carried out on wire bonded 40-pin Dual-in-Line (DIL) High Temperature Co-fired Ceramic (HTCC) electronic packages. Mechanical, optic...
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| Main Authors: | , , , |
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| Format: | Default Article |
| Published: |
2015
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/16942 |
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