Influence of viscoelastic properties of encapsulation materials on the thermomechanical behavior of photovoltaic modules
In this work, the mechanical properties of encapsulation materials for photovoltaic modules have been studied. A finite element model has been developed to simulate the degradation of solder bonds within modules subjected to different environmental conditions. Various polymeric encapsulants are char...
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Main Authors: | Michael Owen-Bellini, Daniel Montiel-Chicharro, Jiang Zhu, Tom Betts, Ralph Gottschalg |
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Format: | Default Article |
Published: |
2017
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Subjects: | |
Online Access: | https://hdl.handle.net/2134/27476 |
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