Influence of viscoelastic properties of encapsulation materials on the thermomechanical behavior of photovoltaic modules

In this work, the mechanical properties of encapsulation materials for photovoltaic modules have been studied. A finite element model has been developed to simulate the degradation of solder bonds within modules subjected to different environmental conditions. Various polymeric encapsulants are char...

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Bibliographic Details
Main Authors: Michael Owen-Bellini, Daniel Montiel-Chicharro, Jiang Zhu, Tom Betts, Ralph Gottschalg
Format: Default Article
Published: 2017
Subjects:
Online Access:https://hdl.handle.net/2134/27476
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