Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects
This paper reports on the interfacial reactions and lifetime of electroless Ni-P coatings in contact with molten Sn-Bi based solders. A layer of approximately 4 m thick electroless Ni-P in contact with the molten Sn-58Bi solder began to fail at 48 h at temperatures between 200 C and 240 C. Elemental...
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| Main Authors: | , , , , , , |
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| Format: | Default Article |
| Published: |
2008
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3790 |
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