Study of self-alignment of μBGA packages
In this paper, a detailed study of the self-alignment of BGA packages is presented. Complete self-alignment can be achieved even for a misalignment of the package of larger than 50% off the test board pad centres. A small residual displacement of the package from perfect alignment after reflow is ob...
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Main Authors: | , , , , , |
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Format: | Default Article |
Published: |
2000
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Subjects: | |
Online Access: | https://hdl.handle.net/2134/4105 |
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