Study of self-alignment of μBGA packages

In this paper, a detailed study of the self-alignment of BGA packages is presented. Complete self-alignment can be achieved even for a misalignment of the package of larger than 50% off the test board pad centres. A small residual displacement of the package from perfect alignment after reflow is ob...

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Bibliographic Details
Main Authors: K.C. Hung, Y.C. Chan, P.L. Tu, H.C. Ong, D. Patrick Webb, J.K.L. Lai
Format: Default Article
Published: 2000
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Online Access:https://hdl.handle.net/2134/4105
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