Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications
Liquid solder interconnects are promising as an alternative approach to conventional high melting point solder interconnects for applications where the operating temperature is likely to exceed 125°C. In order to ensure that a liquid solder interconnect remains in contact with the terminations on th...
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| Main Authors: | , , , , , , , , |
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| Format: | Default Conference proceeding |
| Published: |
2005
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4211 |
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