Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints
It is well known that in surface mount technology (SMT), thermal strains in electronic assemblies are induced in the solder joints by the mismatch between the coefficients of thermal expansion (CTE) of the components, substrate and solder, both during their processing and in service. Therefore, ther...
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| Main Authors: | , , |
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| Format: | Default Conference proceeding |
| Published: |
2008
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4214 |
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