Thermo-mechanical modelling of polymer encapsulated electronics
This paper reports on some initial results from a research project investigating a novel technology for the manufacture of recyclable polymeric modules with embedded electronic systems. The aim of this project is to develop a technology that fully encapsulates electronics for use in the demanding au...
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| Main Authors: | , , , , |
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| Format: | Default Text |
| Published: |
2004
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3976 |
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