Tailoring thermal profiles for the reflow of SMD assemblies
The aim is to investigate the effects of various types of thermal components (also known as heat thieves/barriers) on the thermal profiles of a printed circuit board (PCB). It is demonstrated that it is practical to apply modeling techniques to the IR reflow soldering process. Results show that the...
Saved in:
Main Authors: | A.C.T. Tang, David Whalley, David Williams |
---|---|
Format: | Default Text |
Published: |
1990
|
Subjects: | |
Online Access: | https://hdl.handle.net/2134/3974 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Process variables in the reflow soldering of surface mount
by: Paul Conway, et al.
Published: (1990) -
Solder paste reflow modeling for flip chip assembly
by: Samjid H. Mannan, et al.
Published: (2000) -
A process model of the infra-red reflow soldering of printed circuit board assemblies
by: David Whalley, et al.
Published: (1991) -
Reflow soldering process simulation: a simplified model
by: David Whalley
Published: (2002) -
Automated adaptive control of the reflow soldering of electronic assemblies
by: Paul Conway, et al.
Published: (1997)