Tailoring thermal profiles for the reflow of SMD assemblies
The aim is to investigate the effects of various types of thermal components (also known as heat thieves/barriers) on the thermal profiles of a printed circuit board (PCB). It is demonstrated that it is practical to apply modeling techniques to the IR reflow soldering process. Results show that the...
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| Main Authors: | , , |
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| Format: | Default Text |
| Published: |
1990
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3974 |
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