Effect of thermal aging on interfacial behaviour of copper ball bonds
Thermosonic copper ball bonding is an interconnection technology that serves as a viable and cost-saving alternative to gold ball bonding. However, the reliability of copper bonds remains to be ascertained. Intermetallic compounds (IMCs) and possible voids and cracks may grow and propagate at the in...
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| Main Authors: | , , |
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| Format: | Default Conference proceeding |
| Published: |
2008
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/5334 |
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