IGBT package design for high power aircraft electronic systems
This paper will discuss the design of semiconductor packages having integrated air cooled heatsinks for use in high power electronic systems. It will demonstrate how simple models of the heat transfer from the heatsink fins, which are based on empirical correlations, may be utilised in combination w...
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| Main Authors: | , |
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| Format: | Default Text |
| Published: |
2000
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3928 |
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