On reproducing the copper extrusion of through-silicon-vias from the atomic scale

On reproducing the copper extrusion of through-silicon-vias from the atomic scale

Three-dimensional system integration with through-silicon-vias (TSVs) is regarded as a promising solution to the 'More-than-Moore' challenge to improve the performance of micro- and nano-electronic devices. However, the copper extrusion of TSVs during the back-end-of-the-line (BEOL) proces...

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Bibliographic Details
Main Authors: Jinxin Liu, Zhiheng Huang, Paul Conway, Frank Altmann, Matthias Petzold, Falk Naumann
Format: Default Conference proceeding
Published: 2017
Subjects:
Mechanical engineering not elsewhere classified
Copper extrusion
Through-silicon-via (TSV)
Phase field crystal (PFC) model
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/28448
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https://hdl.handle.net/2134/28448

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