Characterization and improvement of copper / glass adhesion
The development of glass substrates for use as an alternative to printed circuit boards (PCBs) attracts significant industrial attention, because of the potential for low cost but high performance interconnects and optical connection. Electroless plating is currently used to deposit conductive track...
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| Format: | Default Thesis |
| Published: |
2012
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| Online Access: | https://hdl.handle.net/2134/10056 |
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