Electrodeposition of indium bumps for ultrafine pitch interconnections

Electrodeposition of indium bumps for ultrafine pitch interconnections

Microelectronics integration continuously follows the trend of miniaturisation for which the technologies enabling fine pitch interconnection are in high demand. The recent advancement in the assembly of Hybrid Pixel Detectors, a high resolution detecting and imaging device, is an example of where n...

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Bibliographic Details
Main Author: Yingtao Tian
Format: Default Thesis
Published: 2010
Subjects:
Mechanical engineering not elsewhere classified
Ultrafine pitch bumping
Indium bump bonding
Electrodeposition / electroplating
Direct current
Pulse electroplating
Pulse reverse electroplating
Bump uniformity
Bumping yield
Ultrasonic agitation
Megasonic agitation
Wafer / pattern / feature scale
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/7122
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https://hdl.handle.net/2134/7122

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