Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging
For the high-power modules packaging, Cu clip bonding has gained growing interest to replace the multiple wire-bonding for the benefits of lower resistance and improved thermal performance, which is especially beneficial for higher reliability. However, the current interconnection materials and bond...
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| Main Authors: | , , , , , |
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| Format: | Default Article |
| Published: |
2022
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/21546546.v1 |
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