Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding

Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding

Self-propagating exothermic reaction (SPER) of alternating metal nanolayers provides intense localised heat that allows bonding of metals or alloys under ambient temperature. However, the formation of the bonds through the rapid heating and cooling confined at the bonding interfaces is a non-equilib...

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Bibliographic Details
Main Authors: Shuibao Liang, Yi Zhong, Stuart Robertson, Allan Liu, Han Jiang, Canyu Liu, Zhaoxia Zhou, Changqing Liu
Format: Default Article
Published: 2022
Subjects:
Self-propagating exothermic reaction
Thermal transfer
Cooling rate
Solidification
Phase field simulation
Applied Physics
Online Access:https://hdl.handle.net/2134/21501597.v1
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https://hdl.handle.net/2134/21501597.v1

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