Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

This paper presents a novel strategy for transient liquid phase bonding (TLPB) in three-dimensional integrated circuit (3D IC) integration that utilizes a preformed Cu-Sn nanocomposite interlayer based on patterned copper nanowire array. This unique interlayer significantly accelerates the bonding p...

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Bibliographic Details
Main Authors: Han Jiang, Stuart Robertson, Shuibao Liang, Zhaoxia Zhou, Liguo Zhao, Changqing Liu
Format: Default Article
Published: 2021
Subjects:
3D IC integration
Transient liquid phase bonding
Intermetallic joint
Nanocomposite layer
Nanowire array
Online Access:https://hdl.handle.net/2134/19064300.v1
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https://hdl.handle.net/2134/19064300.v1

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