Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters
Glass is a promising substitute substrate material being evaluated for electronic packaging technology. Improving the electroless copper plated layer adhesion of the glass is one of the most important considerations for development of the technology. An excimer laser (248 nm) was used for structured...
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| Main Authors: | , , , |
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| Format: | Default Article |
| Published: |
2015
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/14241809.v1 |
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