Electrical conduction stability of copper-filled adhesives in high-moisture environments

Electrical conduction stability of copper-filled adhesives in high-moisture environments

Electrical conduction stability of copper-filled adhesives in high-moisture environments

Saved in:
Bibliographic Details
Main Author: Shanda Wang
Format: Default Thesis
Published: 2020
Subjects:
Mechanical engineering not elsewhere classified
Self-Assembled Monolayer
Isotropic Conductive Adhesives
Conduction Mechanism
Failure Mechanism
Electrical Interconnection
Reliability Test
Stability Test
High Moisture
Copper
Epoxy
X-ray Photoelectron Spectroscopy
Scanning Electron Microscopy
Transmission Electron Microscopy
Mechanical Engineering not elsewhere classified
Online Access:https://dx.doi.org/10.26174/thesis.lboro.13020575.v1
Tags: Add Tag
No Tags, Be the first to tag this record!

Internet

https://dx.doi.org/10.26174/thesis.lboro.13020575.v1

Similar Items