Current trends in protective packaging of computers and electronic components Robert J. Peache and Denis O'Sullivan, editors.

Current trends in protective packaging of computers and electronic components Robert J. Peache and Denis O'Sullivan, editors.

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Bibliographic Details
Corporate Authors: Symposium on Current Trends in Protective Packaging of Computers and Electronic Components Phoenix, Ariz., American Society for Testing and Materials, ASTM Committee D-10 on Packaging
Other Authors: Peache, Robert J. (ed.), O'Sullivan, Denis (ed.)
Format: eBook
Language:English
Published: Philadelphia, Pa. : American Society for Testing and Materials, c1988.
Series:Journal of ASTM International. Selected technical papers. STP 994.
Subjects:
Electronic apparatus and appliances > Congresses.
Electronic apparatus and appliances > Packaging > Congresses.
Electric discharges > Congresses.
Online Access:https://compass.astm.org/document/?contentCode=ASTM%7CSTP994-EB%7Cen-US&proxycl=https%3A%2F%2Fsecure.astm.org&fromLogin=true
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