Solder materials / Kwang-Lung Lin.
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| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New Jersey :
World Scientific,
[2018]
|
| Series: | WSPC series in advanced integration and packaging ;
vol. 6. |
| Subjects: | |
| Tags: |
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|
Pilkington Library - Pilkington Main Collection
| Shelfmark: |
671.56/LIN |
|---|---|
| Copy [040476875X] | Available |