Thermal management of telecommunications equipment L.T. Yeh, R.C. Chu.

Thermal management of telecommunications equipment L.T. Yeh, R.C. Chu.

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Bibliographic Details
Main Authors: Yeh, L.-T., (Lian-Tuu), 1944- (Author), Chu, R. C. (Richard C.), 1933- (Author)
Format: eBook
Language:English
Published: New York, New York (ASME, Three Park Avenue. New York, NY 10016) : American Society Of Mechanical Engineers, [2013]
Series:ASME Press book series on electronic packaging.
Subjects:
Electronic apparatus and appliances > Thermal properties.
Telecommunication > Equipment and supplies > Cooling.
Telecommunication > Equipment and supplies > Protection.
Heat > Transmission.
Online Access:http://ebooks.asmedigitalcollection.asme.org/book.aspx?bookid=707
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http://ebooks.asmedigitalcollection.asme.org/book.aspx?bookid=707

Online Resource - Electronic book

Copy [B488653] Available

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