Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li. 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
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Format: | eBook |
Language: | English |
Published: |
[United States] : Hoboken :
IEEE Press ; Wiley,
c2012.
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Subjects: | |
Online Access: | http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551 |
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Item Description: | Includes index. |
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Physical Description: | 1 online resource. |
ISBN: | 9781118166727 (electronic bk.) 1118166728 (electronic bk.) 9780470623466 (hardback) 0470623462 (hardback) |