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  1. 1
    Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.
    by Li, Er-Ping
    Published 2012
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  2. 2
    Proceedings of 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility editor, Er-Ping Li.
    Published 2008
    Other Authors: '; “...Li, Er-Ping...”
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