3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

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Bibliographic Details
Corporate Author: IEEE International Conference on 3D System Integration San Francisco, Calif.
Format: eBook
Language:English
Published: [Piscataway, N.J.] : IEEE, c2009.
Subjects:
Integrated circuits > Congresses.
Integrated circuits > Design and construction > Congresses.
Semiconductor wafers > Congresses.
Three-dimensional imaging > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=5290624
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