Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, EuroSimE 2008. International Conference on date, 20-23 April, 2008. date, 20-23 April, 2008.

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Bibliographic Details
Corporate Author: EuroSimE 2008 Freiburg im Breisgau, Germany
Format: eBook
Language:English
Published: [Piscataway, N.J.] : IEEE Xplore, c2008.
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Online Access:access restricted to subscribers
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