High Density Packaging and Microsystem Integration, 2007 HDP '07, International Symposium on.

High Density Packaging and Microsystem Integration, 2007 HDP '07, International Symposium on. HDP '07, International Symposium on.

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Bibliographic Details
Corporate Author: International Symposium on High Density Packaging and Microsystem Integration
Format: eBook
Language:English
Published: [Piscataway, NJ : IEEE, 2007].
Subjects:
Microelectronic packaging > Congresses.
Integrated circuits > Design and construction > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4283545
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