Fatigue life prediction of solder joints in electronic packages with ANSYS / by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
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| Main Author: | |
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| Other Authors: | , |
| Format: | Book |
| Language: | English |
| Published: |
Boston, Mass. ; London :
Kluwer Academic,
2003.
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| Series: | Kluwer international series in engineering and computer science ;
v. 719 |
| Subjects: | |
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Pilkington Library - Pilkington Main Collection
| Shelfmark: |
621.3810285/MAD |
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| Copy [040267393X] | Available |