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Thermal stress and strain in microelectronics packaging / edited by John H. Lau..
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| Format: | Book |
| Language: | English |
| Published: |
New York :
Van Nostrand Reinhold,
c1993
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Pilkington Library
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Shelfmark:
621.381046/THE |
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Copy number
Shelving location
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Copy [040088514X]
Pilkington Main Collection
Available
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