Thermal stress and strain in microelectronics packaging / edited by John H. Lau..
Saved in:
Other Authors: | |
---|---|
Format: | Book |
Language: | English |
Published: |
New York :
Van Nostrand Reinhold,
c1993
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Pilkington Library - Pilkington Main Collection
Shelfmark: |
621.381046/THE |
---|---|
Copy [040088514X] | Available |